Professional Reliable High Quality
High quality UV
GSCOB Series-4018
Category:
COB packaging technology involves mounting LED chips directly onto a high‑thermal‑conductivity metal or ceramic substrate, enabling direct heat dissipation through the substrate to reduce thermal resistance and deliver excellent thermal performance.
Key words：
Hotline：
Product details
Applications:
1 , printing curing;
2 , glue curing ;
3、 Inkjet printing.
Optoelectronic characteristics:
| Wavelength λp | Power Po | Forward voltage Vf | Current IF | Electrical power Φe | Luminous angle 2Θ 1/2 |
| 365nm | 40-60W | 40-45V | 1-1.4A | 5-7W/cm2 | 30/60° |
| 385nm | 40-80W | 39-44V | 1-2A | 8-10W/cm2 | 30/60° |
| 395nm | 40-80W | 39-44V | 1-2A | 8-10W/cm2 | 30/60° |
| 405nm | 40-80W | 39-44V | 1-2A | 8-10W/cm2 | 30/60° |
Dimensions and specifications:
Product Message
Contact: Mr.Julio Feng
Tel：+86 13431390709
Email: julio1003@greatshine.cn
Add: Building 2, Qifang Industrial Park, Tongyi Industrial Zone, Guzhen Town, Zhongshan City, Guangdong Province
Shenzhen Operations Center Add: Room B1318, 13th Floor, Building B, No. 2, North District, Skyworth Innovation Valley, Shiyan, Bao'an, Shenzhen, Guangdong, China
Copyright: Greatshine Semionductor Technology Co.,Ltd. powered by : 300.cn Zhongshan SEO
