Pay attention to every industry trend, pay attention to Guangsheng Semiconductor
Is there any technical difference between cob and MSD packaging?
Each pixel of the cob panel is a well sealed microcirculation system after packaging. Its electrical function and heat dissipation function are realized through the internal circuit of the colloid. It is a real closed system. No matter how good the sealing performance of each lamp bead of the traditional LED display panel is, its electrical function and heat dissipation function require that the LED chip circuit inside the bracket and the pins outside the bracket should be connected correspondingly, and the external pins should finally be welded to the pad of the lamp position of the PCB board. In fact, it is a real open system.
Quantitative macro system comparison
To compare and evaluate the reliability of a macro system by quantifying the macro system, it is necessary to study and compare the number of factors that affect the reliability of the system. Under the same other conditions, the fewer the factors, the higher the reliability.
The 2K display system cob display panel can reduce at least 8847360 influencing factors compared with the traditional LED display panel. The 2K display system has 2211840 pixels, and the traditional LED display panel has more than 8 million factors that affect the reliability.
The 4K display system cob panel can reduce at least 35389440 influencing factors compared with the traditional LED display panel, while the traditional LED display panel has more than 25 million influencing factors.
The 8K display system cob panel can reduce at least 141557760 influencing factors compared with the traditional LED display panel, while the traditional LED display panel has more than 140 million influencing factors.
Heat dissipation performance comparison
The quality of heat dissipation performance directly affects the service life of LED products. The positive and negative poles of LED chip on cob display panel are directly connected with the circuit on PCB. The shortest heat conduction path, no intermediate medium and the smallest thermal resistance value are the most perfect heat dissipation optimization technologies. The positive and negative poles of the traditional LED display panel LED chip are first connected with the bracket pins through the circuit inside the bracket, and then welded to the PCB circuit. It is an indirect heat dissipation method, with long heat conduction path, indispensable intermediate medium and high thermal resistance.
Comparison of protection performance
The comparison of protection performance is directly reflected in whether the product can reach the civil level. Cob display panel is a technology with the best protection level so far, which is mainly reflected in the following two points: 1 The anti-collision ability is the first to give the positive pressure index and lateral thrust index that a single lamp bead can withstand in the industry. So far, no technology can surpass it. 2. all weather capability when the cob display panel lamp bead is sealed, it has the protection capability of IP65, whether it is used indoors or outdoors. For outdoor applications, in addition to rain and humidity, the aging impact of the cold and heat changes of the ambient temperature and screen temperature on the protective colloid, the corrosive effect of the chemically polluted air on the glue protective layer of the LED display panel, and the technical process capacity and process index detection methods.