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High quality UV
Product details
Process characteristics:
3232 Flip Chip
Eutectic process, lower void ratio, lower thermal resistance, can withstand higher soldering temperature
Dusting process
3.0 ball head 120 degrees
Product Specifications |
Color temperature (K) |
Typical power (W) |
Maximum power (W) |
Typical current (mA) |
Maximum current (mA) |
Voltage (V) |
Luminous flux/Im | CRI |
3535WC5 | W:2700 | 2 | 2.5 | 350 | 400 | 5.7-6.1 | 120-160 | ≥90 |
C:6000 | 2 | 2.5 | 350 | 400 | 5.7-6.1 | 160-200 | ≥90 |
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